Inspection & Metrology
As the device geometry shrinks, the
need for verification of the patterned dimensions as well as detection
of killer defects proportionally arises. Furthermore, with the drive
toward lower operating wavelengths, the conventional refractive optical
design must be replaced with reflective optical systems to enable this
technological achievement. The optical and thermal performance
requirements of the Wafer Inspection systems (WI) for example, requires
a new generation of optical design, source technology, shape accuracy,
and specialty thin film coating to provide an effective, robust, and
cost effective wafer inspection technology offering for 45 nm device
node and beyond.
In this regard, Media Lario
Technologies is uniquely positioned to address these demanding
requirements leveraging its proprietary electroforming expertise tandem
with integrated thermal management know how and highly-specialized thin
film coating knowledge. Furthermore, this will allow migration into an
enhanced value-add product offering through implementation of its
high-precision alignment and integration know how to provide its
worldwide customers with reflective optical subsystems.
Media Lario Technologies regards
this extension of its core competencies as a synergistic growth
potential in semiconductor capital equipment and FPD markets.