Thermal Processing

With the advent of minimizing vertical as well as horizontal dimensions of the semiconductor devices, the need for concentrated and precise heating has been further amplified. Flash annealing, laser annealing operating under fraction of a second heating exposure requires both sub-degree spatial temperature uniformity as well as stability at an affordable cost. Thermally managed highly efficient and precise reflective optics has become an enabler for the realization of next generation ICs and flat panel displays (FPD).

Front-end thermal processes such as source – drain (S/D) activation for the formation of Ultra-Shallow Junctions (USJ) in the device fabrication flow, or amorphous silicon re-crystallization for AMOLED requires highly stable and precise heating. Media Lario Technologies is uniquely positioned to address these demanding requirements leveraging its proprietary electroforming expertise tandem with integrated thermal management know how and highly-specialized thin film coating knowledge.

Media Lario Technologies regards this extension of its core competencies as a synergistic growth potential in semiconductor capital equipment and FPD markets.